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  document number: mc33199 rev. 4.0, 10/2006 freescale semiconductor technical data freescale semiconductor, inc. reserves the right to change the detai l specifications, as may be required, to permit improvements in the design of its products. ? freescale semiconductor, in c., 2006. all rights reserved. automotive iso 9141 serial link driver the mc33199 is a serial interface circuit used in diagnostic applications. it is the interface between the microcontroller and the special k and l lines of the iso diagnostic port. the mc33199 has been designed to meet the ?diagnosis system iso9141? specification. the device has a bi-directional bus k line driver, fully protected against short circuits and over temperature. it also includes the l line receiver, used during the wake up sequence in the iso transmission. the mc33199 has a unique feature which allow transmission baud rate up to 200kbaud. features ? electrically compatible with sp ecification ?diagnosis system iso9141? ? transmission speed up to 200kbaud ? internal voltage reference generator for line comparator thresholds ? txd, rxd and lo pins are 5v cmos compatible ? high current capability of dia pin (k line) ? short circuit protection for the k line input ? over temperature shutdown with hysteresis ? large operating range of driver supply voltage ? large operating temperature range ? esd protected pins ? pb-free packaging designated by suffix code ef figure 1. simplified application diagram lin, iso-9141 j-1850 physical interfaces d suffix ef suffix (pb-free) plastic package 98asb42565b 14 pin soic ordering information device temperature range (t a ) package mc33199d -40c to 125c 14 soic mcz33199ef/r2 33199 vcc lo rxd txd vs l i1 dia gnd 33199 mcu vdd i/o scirxd scitxd v dd v bat iso l-line iso k-line vdd (bus)
analog integrated circuit device data 2 freescale semiconductor 33199 internal block diagram internal block diagram figure 2. 33199 simplifi ed internal block diagram + ? + ? current limit thermal shutdown driver c1 v cc i1 source c2 reference generator protection 33199 vs vcc l i1 dia gnd ref-out lo ref-in-l ref-in-k txd rxd
analog integrated circuit device data freescale semiconductor 3 33199 pin connections pin connections figure 3. 33199 pin connections table 1. pin definitions a functional description of each pin can be found in the functional pin description section, beginning on page 12 . pin number pin name definition 1 vcc 5v typical power supply pin. typi cal supply current is less than 1.5ma 2 ref-in-l input reference for c2 comparator. 3 ref-in-k input reference for c1 comparator. 4 lo this pin control sleep mode, transmit level, and speed. it has a weak pulldown. 5 rxd open drain output of the data on bus. a recessiv e bus = a logic [1], a dominant bus = logic [0]. an external pullup is required. 6 txd data input here will appear on the bus pin. a logi c [0] will assert the bus, a logic [1] will make the bus go to the recessive state. 7, 8 nc no internal connection to these pins. 9 dia provides a battery-level logic signal. 10 gnd electrical common ground and heat removal. a good thermal path will also reduce the die temperature. 11 i1 power input. an external diode is needed for reverse battery protection. 12 l the external bus load resistor connects here to pr event bus pullup in the ev ent of loss of module ground. 13 vs this pin connects to the bus through external components. 14 ref-out internal reference voltage generator output pin. 33199 vcc ref-in-l ref-in-k lo rxd txd nc ref-out vs l i1 gnd dia nc 1 2 3 4 5 6 7 14 13 12 11 10 9 8
analog integrated circuit device data 4 freescale semiconductor 33199 electrical characteristics maximum ratings electrical characteristics maximum ratings table 2. maximum ratings all voltages are with respect to ground unless otherwise no ted. exceeding these ratings may cause a malfunction or permanent damage to the device. ratings symbol value unit electrical ratings (1) vs supply pin dc voltage range transient pulse (2) v s v pulse 0.5 to + 40 2 to + 40 v vcc supply dc voltage range v cc 0.3 to + 6.0 v dia and l pins (2) dc voltage range transient pulse (clamped by internal diode) dc source current dia low level sink current - 0.5 to + 38 -2 - 50 int. limit v v ma ma txd dc voltage range -0.3 to v cc +0.3 v ref-in dc voltage range vs < vcc vs > vcc -0.3 to v cc -0.3 to v s v esd voltage capability v esd +/-2000 v thermal ratings storage temperature t stg 55 to + 150 c operating junction temperature t j 40 to + 150 c thermal resistance, junction to air r tja 180 c/w max power dissipation (@ t a =105 c) p d 250 mw peak package reflow temperature during reflow (3) , (4) t pprt note 4. c notes 1. the device is compatible with spec ification: ?diagnosis system iso9141? 2. see the test circuit ( figure 26 ). transient test pulse according to iso76371 and din 40839, highest test levels 3. pin soldering temperature limit is for 10 seconds maximum dura tion. not designed for immersion so ldering. exceeding these lim its may cause malfunction or permanent damage to the device. 4. freescale?s package reflow capability m eets pb-free requirements for jedec standard j-std-020c. for peak package reflow temperature and moisture sensitivity levels (msl), go to www.freescale.com, search by part number [e.g. remove pref ixes/suffixes and enter the core id to view all orderable parts . (i.e. mc33xxxd enter 33xxx), and review parametrics.
analog integrated circuit device data freescale semiconductor 5 33199 electrical characteristics static electrical characteristics static electrical characteristics table 3. static electric al characteristics characteristics noted under conditions v cc from 4.5v to 5.5v, v s from 4.5v to 20v unless otherwise note. typical values reflect approximate mean at 25c, nominal vcc and vs, at time of device characterization. typical values noted reflect the approximate parameter means at t a = 25 c under nominal conditions unless otherwise noted. characteristic symbol min typ max unit vcc pin 1 vcc supply voltage range v cc 4.5 5.5 v vcc supply current (6) i cc 0.5 1.0 1.5 v ref-in-l pin 2 and ref-in-k pin 3 ref-in-l & ref-in-k input voltage range: for 0 analog integrated circuit device data 6 freescale semiconductor 33199 electrical characteristics static electrical characteristics l input pin 12 high level input threshold voltage (ref-in-l connected to ref-out) v ih v ref min 0.25v v ref 0.325v v ref max 0.4v v low level input threshold voltage (ref-in-l connected to ref-out) v il v ref min -0.2v v ref -0.125v v ref max -0.05v v input hysteresis v hyst 300 450 600 mv leakage current i leak 4.0 10 16 ? l1 input pin 11 static source current i 1s -4.0 -3.0 -2.0 ma static saturation voltage @ i1s=-2ma v i1sat v s - 1.2 v s - 0.8 v s v dynamic source current i 1d -120 -80 -40 ma dynamic saturation voltage @ i1s=-40ma v i1dsat v s - 2.7 v s - 0.85 v s v vs pin 13 vs supply voltage range v s 4.5 20 v vs supply current i s 0.5 1.3 2.0 ma ref-out pin 14 output voltage : @ 3 < v s < 5.6v & iro = +-10 ? @ 5.6 < v s < 18v & iro = +-10 ? @ 18 < v s < 40v & iro = +-10 ? v ref 2.7 0.5 x v s 8.5 3.3 0.56 x v s 10.8 v maximum output current i out -50 50 ? pull-up resistor to vcc r pu 3.0 8.0 12 k ? 6. measured with txd=vcc, i1=vs, dia & l high, no load, ref-in-l and ref-in-k connected to ref-out table 3. static electrical characteristics (continued) characteristics noted under conditions v cc from 4.5v to 5.5v, v s from 4.5v to 20v unless otherwise note. typical values reflect approximate mean at 25c, nominal vcc and vs, at time of device characterization. typical values noted reflect the approximate parameter means at t a = 25 c under nominal conditions unless otherwise noted. characteristic symbol min typ max unit
analog integrated circuit device data freescale semiconductor 7 33199 electrical characteristics dynamic electrical characteristics dynamic electrical characteristics table 4. dynamic electri cal characteristics characteristics noted under conditions vcc from 4.5v to 5.5v, vs from 4.5v to 20v unless otherwise noted. typical values noted reflect the approximate parameter means at t a = 25 c under nominal conditions unless otherwise noted. characteristic symbol min typ max unit delay timing transmission speed 1/t bit 0.0 200k baud high or low bit time t bit 5.0 s rxd output : low to high transition delay time high to low transition delay time t rdr t drf 450 450 ns lo output : low to high transition delay time high to low transition delay time t ldr t ldf 2.0 2.0 s dia output : low to high transition delay time high to low transition delay time t ddr t ddf 650 650 ns i1 output @ vs-i1 > 2.7v : rise time hold time t i1r t i1f 1.5 0.3 4.5 s
analog integrated circuit device data 8 freescale semiconductor 33199 electrical characteristics timing diagrams timing diagrams figure 4. txd to dia ac characteristic figure 5. dia to txd and l to lo ac characteristics . figure 6. current source i1 ac characteristics at static high or low level txd, the current source i1 deliver s a current of 3ma (typ). only during low to high transition, does this current increase to a higher value in order to charge the k line capacitor (cl<4nf) in a short time. t bit txd input signal 0v 5v dia output signal 10v 2v t ddr t ddf +5v +12v ref-out ref-in-l ref-in-k txd i1 dia gnd input signal test point 1nf vcc vbat t bit dia and l 0v 12v rxd ot lo output 4.5v 0.4v t rdr / t ldr t rdf / t ldf input signal signal +5v +12v ref-out ref-in-l ref-in-k txd l dia gnd input signal test points vcc vbat lo rxd 2k 2x30pf 120ma 40ma 4ma 2ma typical i1 waveform current source i1 maximum limit current source i1 minimum limit txd signal 0v 5v t bit t i1f t i1h t i1r
analog integrated circuit device data freescale semiconductor 9 33199 electrical characteristics electrical performance curves figure 7. current source i1 and dia discharge current test schematic electrical per formance curves figure 8. icc supply current versus temperature figure 9. vs supply current vers us vs supply voltage figure 10. is supply voltage versus vs supply voltage figure 11. vs voltage versus is current (v cc =5.5v, v dia , l, i1=20v +5v +12v ref-out ref-in-l ref-in-k txd i 1 dia gnd input signal vcc vbat lo rxd to oscilloscope 10 ? 33nf i1 pulse dia discharge current current -40 c 125 c 25 c
analog integrated circuit device data 10 freescale semiconductor 33199 electrical characteristics electrical performance curves figure 12. ref-out voltage versus vs supply voltage figure 13. ref-out voltage versus ref-out current figure 14. l and dia hysteresis versus temperature figure 15. l and dia current versus l and dia voltage figure 16. dia saturation voltage versus temperature figure 17. dia current limit versus temperature i dia = 40ma
analog integrated circuit device data freescale semiconductor 11 33199 electrical characteristics electrical performance curves figure 18. rxd pull-up resistor versus temperature figure 19. txd and lo saturation voltage versus temperature figure 20. i1 saturation voltage versus temperature figure 21. i1 output dc current versus temperature figure 22. i1 output pulse curr ent versus vs supply voltage figure 23. i1 pulse current width versus temperature rxd lo i=40ma i=2ma
analog integrated circuit device data 12 freescale semiconductor 33199 functional description introduction functional description introduction the mc33199 is a serial interface circuit used in diagnostic applications. it is the interfac e between the microcontroller and the special k and l lines of the iso diagnostic port. the mc33 199 has been designed to meet t he ?diagnosis system iso9141? specification. this product description will detail the functionality of the device (see figure 2, 33199 simplified internal block diagram ). first, the power supply and reference voltage generator will be discusse d, then the paths functions between mcu, k and l lines will be detailed. a dedicated paragraph will tell about the special func tionality of the i1 pin, which allow high baud rates transmi ssion. functional pin description vcc (vcc) 5v typical power supply pin. typical supply current is less than 1.5ma. ref-in-l (ref-in-l) input reference for c2 comparator. this input can be connected directly to ref-out, with or without a resistor network, or to an external reference. ref-in-k (ref-in-k) input reference for c1 comparator. this input can be connected directly to ref-out, with or without a resistor network, or to an external reference. lo (lo) output of c2 comparator, normally connected to a micro- controller i/o. if l input > (r ef-in-l + hyst/2) then output lo is in high state. if l< (ref-in-l - hyst/2) then output lo is in low state, output transistor on. this pin is an open collector structure. a pull up resistor should be added to vcc. drive capability of th is output is 5ma. rxd (rxd) receive output, normally connect ed to a microcontroller i/ o. if dia input > (ref-in-l + hyst /2) then output lo is in high state. if dia < (ref-in-l - hyst/2) then output lo is in low state, output transistor on. this pin has an internal pull up resistor to vcc (2kohm typ). drive capability of this output is 5ma txd (txd) transmission input, is normally connected to a microcontroller i/o.this pin cont rols dia output. if txd is high, the output dia transistor is off. if txd is low the dia output transistor is on. dia (dia) input / output diagnosis bus line pin. this pin is an open collector structure, protected against over current and short circuit to vbat (vs). when turning on (txd low), this pin will pull the bus line to gnd, the current into dia will be internally limited to 60ma typ. the internal power transistor has a thermal shutdown circuit, which forces the dia output off in case of over temperature. dia is also the c1 comparator input. it is protected against both positive and negative over voltage by a 38v zener diode. this pin exhibits a constant input current of 7.5?a. gnd (gnd) gnd reference for the entire device. i1 (i1) bus source current pin. it is normally tied to dia pin and to the bus line. at static high or low level txd, the current source i1 delivers a current of 3ma (typ ). only during low to high transition, does this current increase to a higher value in order to charge the key line capacitor (cl<4nf) in a short time (see fig 3 and 4). l (l) input for c2 comparator. this pin is protected against both positive and negative over vo ltage by a 38v zener diode. this l line is a second independent input. it can be used for wake up sequence in iso diagnosis or as an additional input bus line. this pin exhibits a consta nt input current of 7.5 ? . vs (vs) 12v typical, or vbat supply pi n for the device. this pin is protected against over voltage transients. ref-out (ref-out) internal reference voltage generator output pin. its value depends on vs (vbat) values. this output can be directly connected to ref-in l and ref- in-k, or through a resistor network. maximum current capability is 50 ? .
analog integrated circuit device data freescale semiconductor 13 33199 functional device operation functional device operation power supplies and reference voltage the device has two power supplies : a 5v supply, vcc, normally connected to the mcu supply voltage. this pin sinks typically 1ma during operation. a vbat supply voltage, vs, normally tied to the car battery voltage. this pin can sustain up to 40v dc. care should be taken for reverse battery protection and transient voltages higher than 40v. the voltage reference generator is supplied from both vcc and vbat. it prov ides reference volt age for the k and l lines comparators thresholds. the reference voltage is dependant on vbat voltage : it is linear versus vbat voltage, for vbat from 5.6v to 18v. below 5.6v and over 18v the reference voltage is clamped (see figure 12 ). the reference is connected externally to the device, through ref- out pin. it is available for other needs. it can supplied 50 ? max (see figure 13 ). path functions between mcu, k and l lines the path function from the mcu to the k line is composed of a driver interfacing directly with the mcu through the txd pin. the txd pin is cmos compatible. this driver controls a power transistor which can be turned on or off. when it is on, it pull the dia pin low. this pin is known as k line in the iso 9141 specification. the dia pin structure is open collector, without pull up component. this allow the connection of several mc33199 on the k line and the use of a single pull up resi stor per system (see figure 25 ). in order to protect the dia pin against short circuits to vbat, the device incorporates a cu rrent limitation (see figure 17 ) and a thermal shutdown. this current limitation will also act when the device drives a k line bus exhibiting large parasitic capacitor value (see special functionality of i1 pin ). the path from this dia pin, or k line, to the mcu is done through a comparator. the comparator threshold voltage is connected to ref-in-k pin. it can be tied to the ref-out voltage, if the vbat dependant threshold is to be achieved. the second input of this compar ator is internally connected to dia pin. the output of the comparator is available on rxd output pin, normally connected to a mcu i/o port. rxd pin has a 2kohms internal pull up resistor. the path from the l line, used during wake-up sequence of the transmission, to the mcu is done through a second comparator. the comparator threshold voltage is connected to ref-in-l pin. as the ref-in-k pin, it can be tied to the refout voltage, if the vbat dependant thre shold need to be achieved. the second input of this comparator is internally connected to l pin. the output of the comparator is available on lo output pin, which is an open collector structure. lo is normally connected to a mcu i/o port. the dia, and l pins can sustain up to 38v dc. care should be taken for reverse battery protection and transient voltages higher than 38v. the dia and l pins both have internal pull down current source of typically 7.5 ? (see figure 15 ). so the l line exhibits a 10 ? pull down current. the dia pin has the same behavior when it is in off state, that is when txd is at logic high level. special functionality of i1 pin the mc33199 has a unique feature which allows the transmission baud rate to be up to 200kbaud. in practice, the k line can be several meters long, and thus can have a large parasitic capacitor value. this parasitic capacitor value will slow down the low to high transition of the k line, and indeed will limit the baud rate transmis sion. for the k line to go from low to high level, the parasitic capacitor need to be charged, and it can only be charged by the pull up resistor. a low pull up resistor value would result in fast charge time of the capacitor, but also in large output current, and large power dissipation in the driver. to avoid this problem, the mc33199 incorporates a dynamic current source, which is temporary activated at the low to high transition of the txd pin, that is when the dia pin or k line should switch from low to high level (see figure 6 & figure 7 ). this current source is available at i1 pin. it has a typical value of 80ma. it is activated for 4 s (see figure 22 & figure 23 ) and is automatically di sabled after this time. during that time it will charge the k line parasitic capacitor. this extra current will quickly rise the k line voltage up to the vbat, and will result in reduce rise time on the k line. with this feature the mc33199 can ensure baud rate transmission of up to 200kbaud. during high to low transition on the k line, the parasitic capacitor of the bus line will be discharged by the output transistor of the dia pin. in this case, the to tal current may exceed the internal current limita tion of the dia pi n. if so, the current limitation will act, and discharge current will be limited to typically 60ma (see figure 7 & figure 17 ). if a high baud rate is necessary, the i1 pin need to be connected to the dia as shown in the typical application figure 24 . the i1 pin can also be left open, if the i1 functionality and high baud rate are not suited in the application.
analog integrated circuit device data 14 freescale semiconductor 33199 typical applications typical applications figure 24. logic diagram and application schematic reference generator thermal shutdown current limit protection + - + - driver vs vcc : 5v ref-out lo ref-in-l ref-in-k rxd txd gnd dia i 1 l i 1 source vcc rxd txd +vbat l line k line car electronic control unit mcu r pu c2 c1 service tester checking system end of line programmation or manufacturer or
analog integrated circuit device data freescale semiconductor 15 33199 typical applications figure 25. typical application with several ecus figure 26. test circuit for transient schaffner pulses test pulses are directly applied to vs and via a capacitor of 1nf to dia and l. the voltage vs is limited to -2v/38v by the transient suppressor diode d1. pulses can occor simultaneously or separately. mcu mc33199 e.c.u # 1 mcu e.c.u # 2 car +vbat l line k line fig 6 : typical application with several ecus car iso diagnostic connector service tester checking system end of line programmation or manufacturer or other ecus r pu mc33199 +12v i1 dia gnd vbat l schaffner generator 2x1nf 2x330pf 100nf d2 d1
analog integrated circuit device data 16 freescale semiconductor 33199 packaging package dimensions packaging package dimensions for the most current package revision, visit www.freescale.com and perform a keyword search using the ?98a? listed below. d suffix ef-suffix (pb-free) plastic package 98asb42565b issue h
analog integrated circuit device data freescale semiconductor 17 33199 revision history revision history revision date description of changes 2.0 8/2006 ? implemented revision history page ? added ef pb-free suffix ? revised figure 1, simplified application drawing. ? converted to freescale format and updated to the prevailing form and style ? removed mc33199ef/r2 and replaced with mcz33199ef/r2 in the ordering information block 3.0 9/2006 ? made unit label corrections on transmission speed , high or low bit time , lo output : , and i1 output @ vs-i1 > 2.7v : on page 7. 4.0 10/2006 ? removed peak package reflow temperature during reflow (solder reflow) parameter from maximum ratings on page 4 . added note with instructions to obtain this information from www.freescale.com .
mc33199 rev. 4.0 10/2006 information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc., 2006. all rights reserved. how to reach us: home page: www.freescale.com e-mail: support@freescale.com usa/europe or locations not listed: freescale semiconductor technical information center, ch370 1300 n. alma school road chandler, arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) support@freescale.com japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor hong kong ltd. technical information center 2 dai king street tai po industrial estate tai po, n.t., hong kong +800 2666 8080 support.asia@freescale.com for literature requests only: freescale semiconductor literature distribution center p.o. box 5405 denver, colorado 80217 1-800-441-2447 or 303-675-2140 fax: 303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com rohs-compliant and/or pb-free versions of freescale products have the functionality and electrical characteristics of thei r non-rohs-compliant and/or non-pb-free counterparts. for further information, see http://www.freescale.com or contact your freescale sales representative. for information on freescale?s environmental products program, go to http:// www.freescale.com/epp .


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